3M Scotch-Weld Epoxy Adhesive 2214 Hi-Temp New Formula

Overview

3M Scotch-Weld Epoxy Adhesive 2214 Hi-Temp New Formula is a versatile, fast-setting one-part 250°F (121°C) curing, 100% solids, paste-consistency epoxy for bonding metals and many high-temperature plastics such as fibreglass-reinforced plastic, polyester and phenolics. The Hi-Temp New Formula is aluminium-filled and deaerated for use where higher strength is needed between 180°F and 350°F (82°C to 177°C); the product page quotes a service range of -67°F to 350°F (-55°C to 177°C). It needs no mixing or measuring, allows rework until heat is applied, and reaches full cure in 60 minutes at 121°C. It meets the UL 94 HB flammability standard. Per the technical data sheet (September 2024): thixotropic non-sag paste (over 1,000,000 cP), gray-brown colour, modified epoxy base, overlap shear strength on cold-rolled steel (MEK/abrade/MEK, 7 days at 23°C) of 17 MPa (2,500 lb/in2), T-peel of 4 N/cm on aluminium and 9 N/cm on steel, Shore D hardness 85, thermal conductivity 0.422 W/m/K and coefficient of thermal expansion 44 x 10-6 m/m/°C (-60 to 80°C). It may be applied by spatula, trowel or flow equipment. Use caution if the bond line is thicker than 1 mm, because an exothermic reaction can occur during cure with intense heat and smoke. Store at 4°C or below; shelf life is 12 months from manufacture at 4°C or below (18 months at -20°C or below). Available in cartridge, quart and pail sizes; for industrial use only.

Specifications

Base Type

One-part heat-curing modified epoxy, aluminium-filled

Service Temperature

-55°C to +177°C

Certifications

UL 94 HB

Technical Information

• One-part, 100% solids, non-sag epoxy paste; no mixing; rework allowed until heat is applied
• Full cure in 60 min at 121°C; -55°C to 177°C service; UL 94 HB
• Overlap shear 17 MPa on steel; Shore D 85; 12-month shelf life stored at 4°C or below

Typical Applications

• High-temperature bonding of aluminium and other metals
• Bonding metals to fibreglass-reinforced plastic, polyester and phenolics
• Structural bonds where thermal impact and ageing are present

Industries

Technical Documents