3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black

Overview

3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two-part, low-viscosity epoxy resin system designed primarily for potting, sealing and encapsulation of many electronic components. The product page highlights a 70-minute work life, a rigid potting compound that is non-corrosive to copper, minimal exotherm, very low shrinkage and UL 94 HB flammability testing; the data sheet adds good thermal shock resistance and excellent electrical properties. According to the technical data sheet (revision May 2026) it mixes 1:1 by volume (1:1.06 B:A by weight), with a black, opaque base and an off-white, opaque accelerator, a worklife of 70 minutes at 23°C, handling strength in 6 hours and full cure in 24 hours, a cured Shore D hardness of 80 and cure shrinkage of 4.09%. Typical 7-day overlap shear strengths are 16.4 MPa (2,380 lb/in2) on sandblasted aluminium, 13.5 MPa on cold-rolled steel, 9.7 MPa on copper and 14.1 MPa on epoxy FRP. Store at 16-27°C in the unopened package and use within 18 months of manufacture. It is supplied as a 48.5 mL Duo-Pak.

Specifications

Base Type

Two-part low-viscosity epoxy potting compound (1:1)

Service Temperature

N/A

Certifications

UL 94 HB (File E61941)

Technical Information

• 1:1 low-viscosity epoxy; 70-minute work life; handling strength in 6 h; full cure in 24 h
• Negligible exotherm; non-corrosive to copper; Shore D 80; UL 94 HB
• Overlap shear 16.4 MPa on aluminium (7 days); 48.5 mL Duo-Pak

Typical Applications

• Potting, sealing and encapsulating electronic components
• Bonding and potting electrical components
• Rigid, copper-safe potting where thermal shock resistance is needed

Industries

Technical Documents